Physical Vapor Deposition

Physical Vapor Deposition (PVD) is a process used in astronautical engineering to deposit thin films of materials onto a substrate. The process involves the use of a vacuum chamber where a solid material is vaporized and then condensed onto a substrate, forming a thin film. PVD is commonly used in the production of spacecraft components, such as thermal control coatings, solar cell coatings, and reflective coatings. The process is also used in the production of microelectronics, such as computer chips and sensors. PVD offers several advantages over other deposition methods, including high purity, precise control of film thickness, and the ability to deposit materials with high melting points. However, the process can be expensive and time-consuming, and requires specialized equipment and expertise.
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